Electronic apparatus and manufacturing method thereof

ABSTRACT

An electronic apparatus includes: an electronic module; a display panel disposed on the electronic module and including a first display region and a second display region adjacent to the first display region, the second display region overlapping the electronic module; and a polarization plate disposed on the display panel and including a first polarization region overlapping the first display region and a second polarization region including a polarization part and a non-polarization part having higher light transmittance than the polarization part, the non-polarization part overlapping the second display region.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2020-0089128, filed on Jul. 17, 2020, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Embodiments of the invention relate generally to an electronic apparatusand a manufacturing method thereof, and more specifically, to anelectronic apparatus including a patterned polarization layer and amanufacturing method thereof.

Discussion of the Background

Various types of display devices have been used to provide imageinformation, and the display devices may each include an electronicmodule that receives external signals or provides output signals to theoutside. For example, the electronic module may include a camera module,a sensor, a sound module, or the like, and in order to increase a regionfor displaying an image, it is being considered to dispose theelectronic module or the like in the region for displaying an image.

Accordingly, it is demanded to maintain display quality and to improvethe sensitivity of the electronic module in the region in which theelectronic module is disposed.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Applicant discovered that when a display device with an electronicmodule is manufactured with a polarization layer on the electronicmodule, the polarization layer overlapping the electronic module maydegrade the performance of the electronic module.

Display devices with an electronic module constructed according to theprinciples of the invention are capable of improving the performance ofthe electronic module and the display quality of the display devices byincreasing transmittance in a display region overlapping the electronicmodule through providing a patterned polarization layer.

Methods of manufacturing the display devices according to the principlesof the invention improve the performance of the electronic module andthe display quality of the display devices by increasing transmittancein the display region overlapping the electronic module throughproviding the patterned polarization layer.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

According to an aspect of the invention, an electronic apparatusincludes: an electronic module; a display panel disposed on theelectronic module and including a first display region and a seconddisplay region adjacent to the first display region, the second displayregion overlapping the electronic module; and a polarization platedisposed on the display panel and including a first polarization regionoverlapping the first display region and a second polarization regionincluding a polarization part and a non-polarization part having higherlight transmittance than the polarization part, the non-polarizationpart overlapping the second display region.

The polarization plate may include a polarizer layer as an uppermostlayer, and the polarizer layer may include a polymer film and a lightabsorber dispersed in the polymer film.

A number of the light absorber per unit area in the non-polarizationpart may be smaller than a number of the light absorber per unit area inthe first polarization region and the polarization part.

The non-polarization part may be formed by removing the light absorberfrom the polymer film.

The display panel may include: a base layer; a circuit layer disposed onthe base layer and including at least one metal pattern; and alight-emitting element layer disposed on the circuit layer and includinga first electrode and a second electrode facing each other, and anemission layer disposed between the first electrode and the secondelectrode, wherein the second display region may include a non-pixelregion that may not include the at least one metal pattern and the firstelectrode, and a pixel region that may include the at least one metalpattern and the first electrode.

The non-pixel region may overlap the non-polarization part, and thepixel region may overlap the polarization part.

The polarization part may overlap at least one among the at least onemetal pattern and the first electrode; and the non-polarization part maynot overlap both the at least one metal pattern and the first electrode.

The at least one metal pattern may include at least one among a lowershield pattern, a transistor, and a connection electrode.

The non-polarization part may not overlap the at least one metalpattern.

Each of the first display region and the second display region mayinclude a plurality of pixel units; and a number of the pixel units perunit area in the second display region may be smaller than a number ofthe pixel units per unit area in the first display region.

Each of the plurality of pixel units may include a first colorlight-emitting region, a second color light-emitting region, and a thirdcolor light emitting region.

The first display region may include a first pixel unit including aplurality of light-emitting regions arranged spaced apart from eachother when viewed in a plane; and the second display region may includea second pixel unit may include a plurality of light-emitting regionsarranged different from an arrangement of the plurality oflight-emitting regions in the first pixel unit.

The second display region may have a lower pixel density or a lowerwiring density than the first display region.

The electronic apparatus may further include a support member disposedunder the display panel and including a through-hole overlapping theelectronic module.

According to another aspect of the invention, a manufacturing method ofan electronic apparatus includes the steps of: providing a display panelincluding a first display region and a second display region adjacent tothe first display region, the second display region having differenttransmittance from the first display region; providing, on the displaypanel, a polarization plate including a first polarization regionoverlapping the first display region and a second polarization regionoverlapping the second display region; and patterning the providedpolarization plate, wherein the step of patterning of the polarizationplate includes the steps of: irradiating laser light in the seconddisplay region from under the display panel; and providing a cleaningliquid to the second polarization region from above the polarizationplate.

The polarization plate may include a polarizer layer disposed in thefirst polarization region and the second polarization region; thepolarizer layer may include a polymer film and a light absorberdispersed in the polymer film; the step of irradiating the laser lightin the second display region may include the step of detaching the lightabsorber in the polymer film; and the step of providing of the cleaningliquid may include the step of extracting the detached light absorber.

The step of patterning of the polarization plate may include the step ofpatterning the second polarization region into a polarization part and anon-polarization part having higher light transmittance than thepolarization part; and the non-polarization part may be a portion formedby detaching the light absorber from the polymer film.

The display panel may include: a base layer; a circuit layer disposed onthe base layer and including a metal pattern; and a light-emittingelement layer disposed on the circuit layer and including a firstelectrode, a second electrode, and an emission layer disposed betweenthe first electrode and the second electrode, and in the step ofirradiating the laser light in the second display region, the laserlight may be irradiated in a direction to the polarization plate fromunder the base layer by using at least one among the metal pattern orthe first electrode serving as a mask.

The step of patterning of the polarization plate may include the step ofpatterning the second polarization region so as to include apolarization part that may overlap at least one among the metal patternor the first electrode and a non-polarization part that may not overlapthe metal pattern and the first electrode.

The laser light may be selected from a wavelength range of about 340 nmto about 810 nm.

The step of irradiating the laser light in the second display region andthe step of providing of the cleaning liquid may be performed in a samestep.

The step of providing of the cleaning liquid may include the step ofproviding the cleaning liquid by using a spray method, a steam jetmethod, or a dipping method.

The cleaning liquid may be a neutral solution.

The cleaning liquid may be deionized water.

The manufacturing method may further include the step of disposing anelectronic module under the display panel after the step of patterningof the polarization plate.

The step of disposing of the electronic module may include the step ofdisposing the electronic module so as to overlap the second displayregion.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention, andtogether with the description serve to explain the inventive concepts.

FIG. 1 is a perspective view of an embodiment of an electronic apparatusconstructed according to the principles of the invention.

FIG. 2 is an exploded perspective view of the electronic apparatus ofFIG. 1.

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 2.

FIG. 4 is a cross-sectional view taken along line II-IF of FIG. 2.

FIG. 5A is a cross-sectional view of a polarization plate of theelectronic apparatus of FIG. 2.

FIG. 5B is a plan view of the polarization plate of FIG. 5A.

FIG. 6 is a cross-sectional view of a display panel of the electronicapparatus of FIG. 2.

FIG. 7 is a plan view of the display panel of FIG. 6.

FIG. 8 is a plan view of region AA′ of FIG. 7.

FIG. 9 is a plan view of a pixel unit of the display panel of theelectronic apparatus of FIG. 2.

FIG. 10 is a plan view of region BB′ of FIG. 7.

FIG. 11 is a plan view of a pixel unit and non-pixel unit of FIG. 10.

FIG. 12 is a cross-sectional view of an embodiment of the display paneland the polarization plate of the electronic apparatus of FIG. 2.

FIG. 13 is a cross-sectional view of another embodiment of the displaypanel and the polarization plate of the electronic apparatus of FIG. 2.

FIG. 14 is a plan view of a sensing region in the electronic apparatusof FIG. 1.

FIG. 15 is a cross-sectional view of another embodiment of the displaypanel and the polarization plate of the electronic apparatus of FIG. 2.

FIG. 16 is a flowchart illustrating a manufacturing method for theelectronic apparatus of FIG. 1 according to the principles of theinvention.

FIGS. 17, 18, and 19 are views each schematically illustrating steps ofa manufacturing method for the electronic apparatus of FIG. 1.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various embodiments may bepracticed without these specific details or with one or more equivalentarrangements. In other instances, well-known structures and devices areshown in block diagram form in order to avoid unnecessarily obscuringvarious embodiments. Further, various embodiments may be different, butdo not have to be exclusive. For example, specific shapes,configurations, and characteristics of an embodiment may be used orimplemented in another embodiment without departing from the inventiveconcepts.

Unless otherwise specified, the illustrated embodiments are to beunderstood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the DR1-axis, theDR2-axis, and the DR3-axis are not limited to three axes of arectangular coordinate system, such as the x, y, and z-axes, and may beinterpreted in a broader sense. For example, the DR1-axis, the DR2-axis,and the DR3-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another. For thepurposes of this disclosure, “at least one of X, Y, and Z” and “at leastone selected from the group consisting of X, Y, and Z” may be construedas X only, Y only, Z only, or any combination of two or more of X, Y,and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, theterm “and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various embodiments are described herein with reference to sectionaland/or exploded illustrations that are schematic illustrations ofidealized embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments disclosed herein should not necessarily beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. In this manner, regions illustrated in the drawings maybe schematic in nature and the shapes of these regions may not reflectactual shapes of regions of a device and, as such, are not necessarilyintended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Hereinafter, an electronic apparatus according to an embodiment of theinventive concept will be described with reference to drawings.

FIG. 1 is a perspective view of an electronic apparatus in anembodiment. FIG. 2 is an exploded perspective view of an electronicapparatus according to an embodiment, and FIGS. 3 and 4 are each across-sectional view of an electronic apparatus according to anembodiment. FIG. 3 is a cross-sectional view taken along line I-I′ ofFIG. 2. FIG. 4 is a cross-sectional view taken along line II-IF of FIG.2.

An electronic apparatus DD according to an embodiment may be anapparatus activated in response to an electric signal. For example, theelectronic apparatus DD may be a portable phone, a tablet computer, acar navigation unit, a game machine, or a wearable device, butembodiments are not limited thereto. FIG. 1 exemplarily illustrates thatthe electronic apparatus DD is a portable phone.

The electronic apparatus DD may display an image IM through an activeregion AA-DD. The active region AA-DD may include a plane defined by afirst direction axis DR1 and a second direction axis DR2. The activeregion AA-DD may further include a curved surface bent from at least oneside of a plane defined by the first direction axis DR1 and the seconddirection axis DR2. The electronic apparatus DD according to anembodiment illustrated in FIG. 1 is illustrated to include two curvedsurfaces respectively bent from both side surfaces of the plane definedby the first direction axis DR1 and the second direction axis DR2.However, embodiments are not limited to the shape of the active regionAA-DD. For example, the active region AA-DD may include only the plane,and the active region AA-DD may further include four curved surfacesrespectively bent from at least two or more, for example, four sides ofthe plane.

Meanwhile, FIG. 1 and the drawings below illustrate the first directionaxis DR1 to third direction axis DR3, and the directions indicated bythe first, second, and third direction axes DR1, DR2 and DR3 describedin the following descriptions are relative concepts and may be convertedinto other directions. In addition, the directions indicated by thefirst, second, and third direction axes DR1, DR2 and DR3 may bedescribed as first, second, and third directions, and the same referencesymbols may be used.

In the following descriptions, the first direction axis DR1 and thesecond direction DR2 are orthogonal to each other, and the thirddirection axis DR3 may be a normal line direction with respect to theplane defined by the first direction DR1 and the second direction DR2.

A sensing region SA-DD may be defined within the active region AA-DD ofthe electronic apparatus DD. FIG. 1 exemplarily illustrates a singlesensing region SA-DD, but embodiments are not limited to the number ofthe sensing regions SA-DD. The sensing region SA-DD may be a portion ofthe active region AA-DD. Accordingly, the electronic apparatus DD maydisplay an image through the sensing region SA-DD.

An electronic module EM may be disposed in a region overlapping thesensing region SA-DD. The electronic module EM may receive an externalinput transmitted through the sensing region SA-DD or provide an outputthrough the sensing region SA-DD.

Referring to FIGS. 1, 2, 3, and 4, the electronic apparatus DD mayinclude a display region DA and a non-display region NDA adjacent to thedisplay region DA. The display region DA may be a portion correspondingto an active region AA of a display panel DP to be described later, andthe non-display region NDA may be a portion corresponding to aperipheral region NAA of the display panel DP.

The non-display region NDA may be a region that blocks an opticalsignal, is disposed outside the display region DA, and surrounds thedisplay region DA. In an embodiment, the non-display region NDA may notbe disposed on the front surface, but may be disposed on a side surfaceof the electronic apparatus DD. In an embodiment, the electronicapparatus DD may not have the non-display region NDA.

The electronic apparatus DD according to an embodiment may include anelectronic module EM, a display panel DP disposed on the electronicmodule EM, and a polarization plate PM disposed on the display panel DP.A support member SP may be disposed under the display panel DP, and athrough-hole HH overlapping the electronic module EM may be defined inthe support member SP.

The electronic apparatus DD according to an embodiment may include awindow WM disposed on the display panel DP. In addition, the electronicapparatus DD according to an embodiment may include a housing HUdisposed under the display panel DP. The electronic module EM, thedisplay panel DP, and the like may be accommodated in the housing HU.

In the electronic apparatus DD according to an embodiment, the window WMand the housing HU may be coupled to constitute the outer appearance ofthe electronic apparatus DD. In the electronic apparatus DD according toan embodiment, the electronic module EM may be an electronic componentthat outputs or receives an optical signal. For example, the electronicmodule EM may be a camera module for capturing an external image. Inaddition, the electronic module EM may be a sensor module such as aproximity sensor or an infrared light-emitting sensor.

In an electronic apparatus DD according to an embodiment, the displaypanel DP may be disposed on the electronic module EM. The display panelDP may include an active region in which an image IM is displayed, and aperipheral region NAA adjacent to the active region AA. For example, thefront surface IS of the display panel DP may include the active regionAA and the peripheral region NAA. The active region AA may be a regionwhich is activated in response to an electrical signal.

The peripheral region NAA may be adjacent to the active region AA. Theperipheral region NAA may surround the active region AA. In theperipheral region NAA, a drive circuit or a drive line for driving theactive region AA, various signal lines or pads for providing electricalsignals to the active region AA, or the electronic elements.

The display panel DP may include a first display region NSA-EP and asecond display region SA-EP. The second display region SA-EP may be aregion overlapping the electronic module EM, and the first displayregion NSA-EP may be a region that is disposed to surround at least aportion of the second display region SA-EP. The second display regionSA-EP may correspond to the sensing region SA-DD of the electronicapparatus DD. The first display region NSA-EP may be a portioncorresponding to the active region AA-DD excluding the sensing regionSA-DD in the electronic apparatus.

When viewed in a plane, the area of the second display region SA-EP maybe smaller than the area of the first display region NSA-EP. Thetransmittance of the first display region NSA-EP and the second displayregion SA-EP may be different from each other. The transmittance of thesecond display region SA-EP may be greater than the transmittance of thefirst display region NSA-EP.

Meanwhile, in the display panel DP according to an embodiment, a portionof a drive circuit, a drive line, or the like for driving pixels PX(e.g., in FIG. 7) disposed in the second display region SA-EP may bedisposed in the peripheral region NAA. Thus, the wiring density in thesecond display region SA-EP may be lower than the wiring density in thefirst display region NSA-EP. However, embodiments are not limitedthereto, and the wiring density in the first display region NSA-EP maysubstantially be the same as the wiring density in the second displayregion SA-EP. The display panel DP may include a light-emitting elementlayer DP-ED (e.g., in FIG. 6) that includes an organic light-emittingelement, a quantum dot light-emitting element, a micro LEDlight-emitting element, or a nano LED light-emitting element. Thelight-emitting element layer DP-ED (e.g., in FIG. 6) may be aconfiguration that actually generates an image.

In an electronic apparatus DD according to an embodiment, thepolarization plate PM may be disposed on the display panel DP. Thepolarization plate PM may be disposed between the display panel DP andthe window WM. In an embodiment, the polarization plate PM may include apolarizer layer (e.g., in FIG. 5A). The polarization plate PM mayperform a reflection preventing function for reducing reflection due tolight incident from the outside of the electronic apparatus DD.

The polarization plate PM may include a first polarization region NSA-Pand a second polarization region SA-P. The second polarization regionSA-P may be a portion overlapping the electronic module EM and a portioncorresponding to the sensing region SA-DD of the electronic apparatus.The first polarization region NSA-P may be disposed to surround at leasta portion of the second polarization region SA-P. The lighttransmittance in the first polarization region NSA-P may be lower thanthe average light transmittance in the second polarization region SA-P.For example, the average transmittance of the polarization plate PM maybe about 50% or less in the first polarization region NSA-P. Inaddition, the average transmittance of the polarization plate PM may beabout 50% or greater in the second polarization region SA-P.Specifically, the average light transmittance of the polarization platePM may be about 70% or greater in the second polarization region SA-P.

The first polarization region NSA-P of the polarization plate PM may bea portion overlapping the first display region NSA-EP of the displaypanel DP, and the second polarization region SA-P may be a portionoverlapping the second display region SA-EP of the display panel DP.

In the electronic apparatus DD according to an embodiment, the displaypanel DP and the polarization plate PM will be described in detail withreference to drawings.

Referring to FIGS. 2, 3, and 4 and the like, the support member SP maybe disposed under the display panel DP. The support member SP mayinclude a cushion layer CM and a metallic support layer MP. In addition,the support part SP may further include at least one of adhesive layersAP3 and AP4. The adhesive layers AP3 and AP4 may be optically clearadhesive layers.

A through-hole HH may be defined in the support member SP. Thethrough-hole HH may be defined so as to pass through the cushion layerCM and the metallic support layer MP. In addition, the through-hole HHmay be likewise defined passing through the adhesive layers AP3 and AP4included in the support member SP.

The through-hole HH may be defined so as to be disposed in the activeregion AA of the display panel DP. In the electronic apparatus DD, thesecond display region SA-EP of the display panel DP may also be aportion corresponding to the through-hole HH. The second polarizationregion SA-P of the polarization plate PM may be a portion correspondingto the through-hole HH. The electronic module EM may overlap the throughhole HH. At least a portion of the electronic module EM may be disposedto be inserted in the through-hole HH.

The cushion layer CM may be provided to protect the display panel DP andthe electronic module EM from a physical shock applied from the outsideof the electronic apparatus DD. In addition, the cushion layer CM may beprovided in at least a predetermined thickness to implement the throughhole HH. The thickness of the cushion layer CM may be about 50 μm orgreater. For example, the thickness of the cushion layer CM may be about100 μm or greater.

The cushion layer CM may be formed by including at least one among anacrylic-based polymer, a urethane-based polymer, a silicon-basedpolymer, or an imide-based polymer. The cushion layer CM may have astrength capable of protecting the display panel DP and the electronicmodule EM and define the through-hole HH.

An adhesive layer AP3 may be disposed on the cushion layer CM. Theadhesive layer AP3 may couple the cushion layer CM and the display panelDP.

A metallic support layer MP may be a support substrate that supportsmembers included in the electronic apparatus DD such as the displaypanel DP. The metallic support layer MP may be a thin-film metallicsubstrate. The metallic support layer MP may also have a function suchas heat dissipation or electromagnetic wave shield.

In the electronic apparatus DD according to an embodiment, the supportmember SP may further include a panel support part. The panel supportpart may be disposed under the display panel DP. The panel support partmay be disposed between the display panel DP and the cushion layer CM.The panel support part may include a polymer film. The polymer film maybe an optically transparent polyethylene terephthalate (PET) film.

In addition, the support member SP may further include an adhesive layerthat couples a panel support part and the display panel DP, and theadhesive layer may be an optically transparent adhesive layer.

In the electronic apparatus DD according to an embodiment, the window WMmay be disposed on the polarization plate PM. The window WM may coverthe front surface IS of the display panel DP. The window WM may includea base substrate WM-BS and a bezel pattern WM-BZ.

The base substrate WM-BS may be a substrate that includes an opticallytransparent insulating material. The base substrate WM-BS may haveflexibility. For example, the base substrate WM-BS may include a polymerfilm, a substrate including a polymer material, or a thin-film glasssubstrate. The base substrate WM-BS may correspond to a substrate havingno phase difference or a very low phase difference. On the basesubstrate WM-BS, functional layers such as a reflection preventinglayer, a fingerprint preventing layer, or an optical layer forcontrolling phases may further be disposed.

The bezel pattern WM-BZ may be a color layer printed on one surface ofthe base substrate WM-BS or deposited on the base substrate WM-BS. Forexample, the bezel pattern WM-BZ may have a multilayer structure. Themultilayer structure may include a colored layer and a blacklight-blocking layer. The colored layer and the black light-blockinglayer may be formed through a deposition, printing, or coating process.The bezel pattern WM-BZ may be omitted, and may be formed on functionallayers other than the base substrate WM-BS.

The window WM includes an upper surface FS exposed to the outside. Theupper surface FS of the electronic apparatus DD may substantially bedefined by the upper surface FS of the window WM. A transmissive regionTA may be an optically transparent region on the upper surface FS of thewindow WM. The transmissive region TA may have a shape corresponding tothe active region AA of the display panel DP. For example, thetransmissive region TA overlaps the entirety of or at least a portion ofthe active region AA. The image displayed on the active region AA of thedisplay panel DP may be viewed from the outside through the transmissiveregion TA.

On the upper surface FS of the window WM, a bezel region BZA may be aportion to which a bezel pattern WM-BZ is provided. The bezel region BZAmay define the shape of the transmissive region TA. The bezel region BZAmay be adjacent to the transmissive region TA and surround thetransmissive region TA. The bezel region BZA may cover the peripheralregion NAA of the display panel DP and prevent the peripheral region NAAfrom being viewed from the outside.

A sensing region SA may be defined in the transmissive region TA of thewindow WM. The sensing region SA of the window may be defined as thesensing region SA-DD of the electronic apparatus DD.

The display apparatus DD according to an embodiment may further includeadhesive layers AP1 and AP2 disposed at least between the polarizationplate PM and the window WM or between the display panel DP and thepolarization plate PM. The adhesive layers AP1 and AP2 may be opticallytransparent adhesive layers.

FIG. 5A is a cross-sectional view of a polarization plate according toan embodiment, and FIG. 5B is a plan view of the polarization plateaccording to an embodiment. FIGS. 5A and 5B illustrate a portion of asecond polarization region SA-P and a first polarization region NSA-Pdisposed to surround the second polarization region SA-P. The firstpolarization region NSA-P may be a portion overlapping the first displayregion NSA-EP of the display panel, and the second polarization regionSA-P may be a portion overlapping the second display region SA-EP of thedisplay panel.

The polarization plate PM according to an embodiment may include apolarizer layer PL. The polarizer layer PL may be included in theuppermost layer of the polarization plate PM. The polarizer layer PL maybe the outermost layer and may constitute the upper surface of thepolarization plate PM spaced apart from the display panel DP (e.g., inFIG. 4).

The polarizer layer PL may be an optical layer for linearly polarizingthe provided light in one direction. For example, the polarizer layer PLmay be a linear polarizing layer, but embodiments are not limitedthereto. The polarizer layer PL may be a film-type linear polarizerincluding a stretched polymer film. For example, the stretched polymerfilm may be a stretched polyvinyl alcohol film.

The polarizer layer PL may include a stretched polymer film BF and lightabsorbers AF adsorbed to the polymer film BF. For example, the lightabsorbers AF may be attached to the outer surface of the polymer filmBF. For example, the light absorbers may be dispersed in the polymerfilm BF. The polymer film BF may include polyvinyl alcohol. The lightabsorbers AF may be dichromic dye or iodine. For example, the polarizerlayer PL may be manufactured by applying iodine to be adsorbed onto astretched polyvinyl alcohol film. For example, the iodine may bedispersed in the stretched polyvinyl alcohol film.

At this point, the direction in which the polymer film BF is stretched(e.g., in the first direction DR1) may be an absorption axis of thepolarizer layer PL, and a direction perpendicular to the stretchingdirection may be the transmission axis of the polarizer layer PL (e.g.,in the third direction DR3). In an embodiment, the transmission axis ofthe polarization plate PM may be defined as the transmission axis of thepolarizer layer PL. However, embodiments are not limited thereto, andthe polarization direction may be changed by other optical functionlayers included in the polarization plate PM. In this case, thetransmission axis of the polarization plate PM may not coincide with thetransmission axis of the polarizer layer PL.

In addition, the polarization plate PM may further include at least oneof phase retarding layers RL1 and RL2 which are disposed under thepolarizer layer PL. The polarization plate PM may include a first phaseretarding layer RL1 and a second phase retarding layer RL2. The secondphase retarding layer RL2 may be disposed between the first phaseretarding layer RL1 and the polarizer layer PL. The first phaseretarding layer RL1 and the second phase retarding layer RL2 may each bean optical layer that retards the phase of the provided light. The firstphase retarding layer RL1 may be a λ/4 phase retarder and the secondphase retarding layer RL2 may be a λ/2 phase retarder.

For example, the polarization plate PM according to an embodiment mayfurther include a light compensation layer, a protective layer, asupport layer, an adhesive layer or the like.

The polarization plate PM according to an embodiment may include apolarization part PP and a non-polarization part NP in the secondpolarization region SA-P. In an embodiment, the non-polarization part NPmay be a portion in which light absorbers AF are detached or removedfrom the polymer film BF of the polarizer layer PL, or a portion inwhich only a small amount of light absorbers AF is adsorbed onto thepolymer film BF of the polarizer layer PL.

In an embodiment, the number of light absorbers AF per unit area (e.g.,in a plan view) in the non-polarization part NP may be smaller than thenumber of the light absorbers AF per unit area (e.g., in a plan view) inthe polarization part PP. In addition, the number of the light absorbersAF per unit area (e.g., in a plan view) in the first polarization regionNSA-P may be more than the average number of the light absorbers AF perunit area (e.g., in a plan view) in the second polarization region SA-P.

In an embodiment, the non-polarization part NP is a portion that doesnot have a linear polarization function in the polarizer layer PL, andthe polarization part PP corresponds to a portion, in which the linearpolarization function is maintained, in the polarizer layer PL. Inaddition, the first polarization region NSA-P also corresponds to aportion, in which the linear polarization function is maintained likethe polarization part PP.

In an embodiment, the light transmittance of the non-polarization partNP may be greater than the light transmittance of the polarization partPP. In addition, the light transmittance of the non-polarization part NPmay be greater than the light transmittance of the first polarizationregion NSA-P. The average light transmittance of the second polarizationregion SA-P may be the average light transmittance value of thepolarization part PP and the non-polarization part NP. Thus, the averagelight transmittance of the second polarization region SA-P may begreater than the average light transmittance of the first polarizationregion NSA-P.

FIG. 6 is a cross-sectional view of a display panel according to anembodiment, and FIG. 7 is a plan view of the display panel according toan embodiment.

In an embodiment, a display panel DP includes a base layer BL, a circuitlayer DP-CL disposed on the base layer BL, a light-emitting elementlayer DP-ED, and an upper insulating layer TFL. The base layer BL mayinclude a plastic substrate, a glass substrate, a metal substrate, anorganic/inorganic composite material substrate, or the like. Forexample, the base layer BL may include at least one polyimide layer.

The circuit layer DP-CL may include at least one insulating layer,semiconductor patterns, and conductive patterns. The insulating layermay include at least one inorganic layer and at least one organic layer.The semiconductor patterns and the conductive patterns may constitutesignal lines, a pixel drive circuit, and a scan drive circuit. This willbe described later in detail.

The light-emitting element layer DP-ED includes a display element, forexample, a light-emitting element ED (e.g., in FIG. 12). Thelight-emitting element layer DP-ED may further include an organic layersuch as a pixel defining layer PDL (e.g., in FIG. 12).

The light-emitting element layer DP-ED may be disposed in an activeregion AA. A peripheral region NAA is disposed on the outer periphery ofthe active region AA and surrounds the active region AA, andlight-emitting elements may not be disposed in the peripheral regionNAA.

The upper insulating layer TFL may include a plurality of thin films.Some thin films are disposed to improve optical efficiency, and somethin films are disposed to protect light-emitting elements. The upperinsulating layer TFL may include a thin film encapsulating layerincluding a laminated structure of inorganic layer/organiclayer/inorganic layer.

Meanwhile, the display panel DP may further include a sensor layer. Thesensor layer may detect an external input applied from the outside. Theexternal input may be user's input. The user's input may meanvarious-type external inputs such as a portion of a user's body, light,heat, a pen, or a pressure.

The sensor layer may be formed on the upper insulating layer TFL througha continuous process. In this case, the sensor layer may be expressed tobe directly disposed on the upper insulating layer TFL. The wording“directly disposed” may mean that other components are not disposedbetween the sensor layer and the upper insulating layer TFL. Forexample, a separate adhesive member may not be disposed between thesensor layer and the upper insulating layer TFL. Meanwhile, embodimentsare not limited thereto, and an adhesive member may further be disposedbetween the sensor layer and the upper insulating layer TFL. Meanwhile,in an embodiment, the sensor layer may include a sensing electrode fordetecting an external input, and the sensing electrode may be formed byincluding transparent metal oxides or the like.

As illustrated in FIG. 7, the display panel DP may include a pluralityof signal lines SGL (hereinafter, referred to as signal lines), aplurality of pixels PX (hereinafter, referred to as pixels), and a drivecircuit GDC. Pixels PX are disposed in an active region AA. Each of thepixels PX includes a light-emitting element and a pixel drive circuitconnected thereto. The signal lines SGL and the pixel drive circuit maybe included in the circuit layer DP-CL illustrated in FIG. 6.

The second display region SA-EP may be a portion having a lower pixeldensity than the first display region NSA-EP, or a portion having alower wiring density.

For example, in the display apparatus according to an embodiment, asmaller number of pixels PX may be disposed in the second display regionSA-EP than in the first display region NSA-EP with respect to the sameunit area. A region in which pixels PX are not disposed corresponds to aregion through which an optical signal transmits. However, embodimentsare not limited thereto, and the second display region SA-EP may havesubstantially the same level of pixel density as the first displayregion NSA-EP.

Meanwhile, when the pixel densities in the second display region SA-EPand the first display region NSA-EP are substantially the same, thewiring density of the second display region SA-EP may be lower than thewiring density of the first display region NSA-EP. For example, circuitwiring such as a transistor TR (e.g., in FIG. 13) for driving a secondpixel unit AR1′ (e.g., in FIG. 13) disposed in the second display regionSA-EP may be disposed to be moved to the peripheral region NAA. Thus,the wiring density in the second display region SA-EP may be lower thanthe wiring density in the first display region NSA-EP. The pixels PX arenot disposed in the peripheral region NAA. The drive circuit GDC isdisposed in the peripheral region NAA. In this embodiment, the drivecircuit GDC may include a scan drive circuit. The scan drive circuitgenerates a plurality of scan signals (hereinafter, referred to as scanlines) and sequentially outputs the scan signals to a plurality of scanlines GL (hereinafter, referred to as scan lines). The scan drivecircuit may further output another different control signal to the drivecircuit for the pixels PX.

The scan drive circuit may include a plurality of thin film transistorswhich are formed through the same process as, for example, alow-temperature polycrystalline silicon (LTPS) process or alow-temperature polycrystalline oxide (LTPO) process, by which the drivecircuit for the pixels PX is formed.

The signal lines SGL include scan lines GL, data lines DL, a power linePWL and a control signal line CSL. The signal lines SGL may furtherinclude separate reset lines and light-emitting lines. The scan lines GLare respectively connected to the corresponding pixels PX among thepixels PX, and the data lines DL are respectively connected to thecorresponding pixels PX among the pixels PX. The power line PWL isconnected to the pixels PX. The control signal line CSL may provide thescan drive circuit with control signals.

The signal lines SGL may be connected to a circuit board. The signallines SGL may be connected to a timing control circuit having a shape ofan integrated circuit mounted on the circuit board.

In an embodiment, the signal lines SGL may be disposed on the circuitlayer DP-CL, and may be referred to as at least one metal pattern MTL(e.g., in FIG. 15) included in at least one circuit layer DP-CL amongthe signal lines SGL. For example, the scan lines GL and the data linesDL among the signal lines SGL may be metal patterns MTL (e.g., in FIG.15) that do not overlap a non-polarization part NP (e.g., in FIG. 15) ofa polarization plate.

FIG. 8 is a plan view illustrating region AA′ of FIG. 7. FIG. 8simplifies and illustrates the pixel units disposed in region AA′ ofFIG. 7. FIG. 9 is a plan view illustrating the configuration oflight-emitting regions included in the one pixel unit illustrated inFIG. 8.

Pixels may be disposed in first pixel units AR1 and the first pixelunits AR1 may be regions to which an image is provided. Thus, the firstpixel units AR1 may be referred to as effective regions or imageregions.

Referring to FIGS. 7, 8, and 9, the plurality of first pixel units AR1disposed in the first display region NSA-EP may have disposition ofmutually the same light-emitting regions EA-B, EA-G, and EA-R. The firstlight-emitting region EA-B is an emission region of a first color pixel,the second light-emitting region EA-G is an emission region of a secondcolor pixel, and the third light-emitting region EA-R is an emissionregion of a third color pixel.

Each of the plurality of first pixel units AR1 may include the firstlight-emitting region EA-B, the second light-emitting region EA-G, andthe third light-emitting region EA-R. In this embodiment, it isillustrated that each of the plurality of first pixel units AR1 includea single first light-emitting region EA-B, two second light-emittingregions EA-G, and a single third light-emitting region EA-R. However,embodiments are not limited thereto.

In addition, it is illustrated that the shape of each of thelight-emitting regions EA-B, EA-G and EA-R included in the first pixelunit AR1 has a diamond shape when viewed in a plane, but embodiments arenot limited thereto.

Referring to FIG. 9, in a single pixel unit AR1, the two secondlight-emitting regions EA-G may be disposed spaced apart from each otherin the direction of the first direction axis DR1, and the firstlight-emitting region EA-B and the third light-emitting region EA-R maybe disposed spaced apart from each other with the second light-emittingregions EA-G therebetween. The light-emitting regions EA-B, EA-G andEA-R may be distinguished from each other by a non-light-emitting regionNPA. The light-emitting regions EA-B, EA-G and EA-R may be regionsdivided by a pixel defining layer PDL (e.g., in FIG. 12), and thenon-light-emitting region NPA may be a region overlapping the pixeldefining layer PDL (e.g., in FIG. 12).

In an embodiment, one among the second light-emitting regions EA-Gincluded in the first pixel unit AR1 may also be defined as a fourthlight-emitting region distinguished from the second light-emittingregion EA-G. FIG. 9 illustrates that the two second light-emittingregions EA-G have the same shape and the same area when viewed in aplane, but embodiments are not limited thereto. Unlike thoseillustrated, in an embodiment, the second light-emitting region EA-G andthe fourth light-emitting region may have different shapes from eachother when viewed in a plane.

In an embodiment, the configuration of the first pixel units AR1included in the first display region NSA-EP is not limited to thatillustrated in the drawing, but the number of light-emitting regionsincluded in the single first pixel unit AR1, the ratio between thedifferent light-emitting regions, the disposition relationship betweenthe light-emitting regions, the shapes of the light-emitting regions,and the like may be changed and combined according to display qualityrequired by a display panel DP.

In an embodiment, a single first light-emitting region EA-B may generatea blue light. Each of the two second light-emitting regions EA-G mayeach generate a green light. The one third light-emitting regions EA-Rmay each generate a red light. The blue light, the green light, and thered light may be changed into other three primary color lights.

FIG. 10 is a plan view illustrating region BB′ of FIG. 7. FIG. 10simplifies and illustrates the pixel units disposed in region BB′ ofFIG. 7. FIG. 11 is a plan view illustrating a portion of region BB′illustrated in FIG. 10.

FIG. 10 is a plan view illustrated in region BB′ which is a portion ofthe second display region SA-EP of the display panel DP illustrated inFIG. 7. The second display region SA-EP may include a plurality ofsecond pixel units AR1′ and a plurality of non-pixel units AR2.

Referring to FIGS. 7, 8, 9, and 11, the second display region SA-EP mayinclude the second pixel units AR1′ and the non-pixel unit AR2 which arealternately and repeatedly disposed. The plurality of second pixel unitsAR1′ and the plurality of non-pixel units AR2 may be aligned accordingto a predetermined rule.

Pixels may be disposed in the second pixel units AR1′ and the secondpixel units AR1′ may be regions to which an image is provided. Thus, thesecond pixel units AR1′ may be referred to as effective regions or imageregions.

The light transmittance of the non-pixel units AR2 may be greater thanthat of the second pixel units AR1′. The non-pixel units AR2 may bereferred to as transmissive parts, non-display parts, semi-transmissiveparts, transmissive regions, non-pixel regions, openings, open regionsor the like.

Pixels may not be disposed in the non-pixel units AR2. Light-emittingelements may not be disposed at least in the non-pixel units AR2.Accordingly, the resolution of the second display region SA-EP includingthe second pixel units AR1′ and the non-pixel units AR2 may be lowerthan the resolution of the first display region NSA-EP.

Semiconductor patterns, conductive patterns, or signal lines may not bedisposed in the non-pixel units AR2. In addition, reflective electrodes,non-transmissive electrodes or the like may not be disposed in thenon-pixel units AR2. In addition, in the non-pixel units AR2, an opticalsignal may move through the non-pixel units AR2. For example, a signalprovided from an electronic module (e.g., in FIG. 4) may be output, or asignal input from the outside may be received through the non-pixelunits AR2.

Referring to FIG. 10, the second pixel units AR1′ and the non-pixelunits AR2 may alternately be arranged along the first direction axis DR1and the second direction axis DR2. For example, a single second pixelunit AR1′ and a single non-pixel unit AR2 may alternately be arranged.The non-pixel unit AR2 may have an area corresponding to the area of thesecond pixel unit AR1′. However, embodiments are not limited thereto,and the non-pixel unit AR2 does not necessarily have the same area asthe second pixel unit AR1′.

In addition, the arrangement of the second pixel units AR1′ and thenon-pixel units AR2 is not limited to that illustrated in FIG. 10. Inthe second display region SA-EP, the ratio between the numbers of thesecond pixel units AR1′ and the non-pixel units AR2 may be differentfrom that illustrated in FIG. 10. In an embodiment, the non-pixel unitsAR2 may be aligned in a stripe shape along the first direction axis DR1or the second direction axis DR2, or the numbers of the second pixelunits AR1 and the non-pixel units AR2 may be varied (e.g., in the regionBB′ illustrated in FIG. 10).

FIG. 11 is a plan view for more specifically illustrating theconfiguration of the second pixel units AR1′ and the non-pixel unit AR2in a second display region SA-EP. In an embodiment, the non-pixel unitAR2 may be disposed between the second pixel units AR1′.

The second pixel units AR1′ may include at least three light-emittingregions EA-B, EA-G, and EA-R as illustrated. The second pixel units AR1′may include a first light-emitting region EA-B, a second light-emittingregion EA-G, and a third light-emitting region EA-R. In this embodiment,it is illustrated that each of the plurality of second pixel units AR1′includes a single first light-emitting region EA-B, two secondlight-emitting regions EA-G, and a single third light-emitting regionEA-R. However, embodiments are not limited thereto.

In addition, it is illustrated that the shape of each of thelight-emitting regions EA-B, EA-G and EA-R included in the second pixelunit AR1′ has a rectangular shape when viewed in a plane, butembodiments are not limited thereto.

Referring to FIG. 11, in a single second pixel unit AR1′, the two secondlight-emitting regions EA-G may be disposed spaced apart from eachother, and the first light-emitting region EA-B and the thirdlight-emitting region EA-R may be disposed spaced apart from each otherwith the second light-emitting regions EA-G therebetween. Thelight-emitting regions EA-B, EA-G and EA-R may be distinguished fromeach other by a non-light-emitting region NPA. When the second pixelunits AR1′ include at least three light-emitting regions EA-B, EA-G andEA-R, the non-pixel unit AR2 may have an area greater than the sum of atleast two light-emitting regions among the three light-emitting regionsEA-B, EA-G and EA-R.

Referring to FIGS. 9 and 11, the arranged shapes and the shapes of thelight-emitting regions in the first pixel unit AR1 and the second pixelunits AR1′ may be different from each other. Meanwhile, the sizes of thelight-emitting regions included in the first pixel unit AR1 and thesecond pixel units AR1′, the arrangement of the light-emitting regions,the area ratio between the mutually different light-emitting regions,the shapes of the light-emitting regions, or the like are not limited tothose illustrated in FIGS. 9 and 11.

In addition, unlike illustrated, the first pixel unit AR1 and the secondpixel unit AR1′ may have the same configuration of light-emittingregions.

In an embodiment, the size of the second pixel unit AR1′ may bedifferent from the size of the first pixel unit AR1. For example, thesize of the second pixel unit AR1′ may be greater than the size of thefirst pixel unit AR1.

Region AA′ illustrated in FIG. 8 and region BB′ illustrated in FIG. 10may illustrate the regions of the same unit area. Referring to FIGS. 7,8, 9, and 10, the number of light-emitting regions per unit area (e.g.,the region BB′) in the second display region SA-EP may be smaller thanthe number of light-emitting regions per unit area AA′ in the firstdisplay region NSA-EP. The number of pixel units AR1′ disposed per unitarea (e.g., in a plan view) in the second display region SA-EP may besmaller than the number of pixel units AR1 disposed per unit area (e.g.,in a plan view) in the first display region NSA-EP. In addition, thepixel density in the second display region SA-EP may be lower than thepixel density in the first display region NSA-EP. However, embodimentsare not limited thereto, and the pixel density in the second displayregion SA-EP and the pixel density in the first display region NSA-EPare substantially the same, and the wiring density in the second displayregion SA-EP may be lower than the wiring density in the first displayregion NSA-EP.

FIGS. 12 and 13 are each a cross-sectional view of an electronicapparatus according to an embodiment. FIG. 12 is a cross-sectional viewof a portion of a first display region, and FIG. 13 is a cross-sectionalview of a portion of a second display region.

FIG. 12 is a cross-sectional view illustrating a portion of anelectronic apparatus corresponding to a first light-emitting region EA-Bincluded in the first pixel unit AR1 illustrated in FIG. 8. FIG. 13 is across-sectional view illustrating a portion of an electronic apparatus,the portion corresponding to the first light-emitting regions EA-Bincluded in the second pixel units AR1′ and the non-pixel unit AR2disposed between the second pixel units AR1′.

Referring to FIGS. 12 and 13, an electronic apparatus according to anembodiment may include a display panel DP and a polarization plate PMdisposed on the display panel DP. As illustrated in FIGS. 12 and 13, anadhesive layer AP2 (e.g., in FIG. 4) disposed between the display panelDP and the polarization plate PM may be omitted.

Referring to FIGS. 12 and 13, the display panel DP may include aplurality of insulating layers, semiconductor patterns, conductivepatterns, signal lines, and the like. The insulating layers, thesemiconductor layers, the conductive layers and the like are formedthrough a method such as a coating process or a deposition process.Next, the insulating layers, the semiconductor layers, and theconductive layers may be selectively patterned through aphotolithography method. Through such a method, a semiconductor pattern,a conductive pattern, signal lines and the like, which are included in acircuit layer DP-CL and a light-emitting element layer DP-ED, areformed. Next, an upper insulating layer TFL that covers thelight-emitting element layer DP-ED may be formed.

A transistor TR and a light-emitting element ED may be disposed on abase layer BL. The light-emitting element ED may include a firstelectrode AE, a second electrode CE, and an emission layer EML disposedbetween the first electrode AE and the second electrode CE. In addition,the light-emitting element ED may include a hole transport region HTRdisposed between the first electrode AE and the emission layer EML, andan electron transport region ETR disposed between the emission layer EMLand the second electrode CE.

A first buffer layer BFL1 may be disposed on the base layer BL. Thefirst buffer layer BFL1 may improve the coupling strength between thebase layer BL and a metal pattern such as a lower shield pattern BML.The first buffer layer BFL1 may include at least one among a siliconoxide layer or a silicon nitride layer. For example, the first bufferlayer BFL1 may be formed by alternately stacking or laminating thesilicon oxide layer and the silicon nitride layer.

A lower shield pattern BML may be disposed on the first buffer layerBFL1. Meanwhile, in an embodiment, the first buffer layer BFL1 may beomitted, and in this case, the lower shield pattern BML may be providedon the upper surface of the base layer BL.

The lower shield pattern BML may overlap the transistor TR. The lowershield pattern BML may overlap active part A1 and function as aprotective layer that prevents the degradation in electricalcharacteristics of the active part A1. In addition, in the manufacturingprocess of an electronic apparatus, the lower shield pattern may protectthe transistor TR from laser light or moisture infiltrating orpermeating from under the base layer BL. The lower shield pattern BMLmay be formed of a conductive material having a low light transmittance.For example, the lower shield pattern BML may block a laser beam ofabout 340 nm to about 810 nm.

The second buffer layer BFL2 may be disposed on the lower shield patternBML. The second buffer layer BFL2 may cover the entirety of the lowershield pattern BML. A semiconductor pattern is disposed on the secondbuffer layer BFL2. The semiconductor pattern may include siliconsemiconductor. The semiconductor pattern may also include polysilicon oramorphous silicon. In addition, the semiconductor pattern may alsoinclude a metal oxide semiconductor.

The semiconductor pattern may have electrical properties varyingaccording to whether the semiconductor pattern is doped or not. Thesemiconductor pattern may include a doping region and a non-dopingregion. The doping region may be doped with N-type dopants or P-typedopants. A P-type transistor includes a doping region doped with aP-type dopant.

The doping region has greater conductivity than the non-doping regionand may function as an electrode or a signal line. The non-doping regionmay substantially correspond to an active layer (e.g., a channel) of thetransistor. In other words, a portion of the semiconductor pattern maybe an active layer (e.g., channel) of the transistor, and anotherportion may be a source (e.g., an input electrode region), or a drain(e.g., an output electrode region), and still another portion may be aconnection signal line (e.g., a connection electrode).

As illustrated in FIGS. 12 and 13, a source S1, an active layer A1, adrain D1 of the transistor TR are formed from a semiconductor pattern. Afirst insulating layer 10 may be disposed on the semiconductor pattern.A gate G1 of the transistor TR may be disposed on the first insulatinglayer 10. A second insulating layer 20 may be disposed on the gate G1. Athird insulating layer 30 may be disposed on the second insulating layer20.

The connection electrode CNE may be disposed between the transistor TRand a light-emitting element ED and connect the transistor TR and thelight-emitting element ED. The connection electrode CNE may include afirst connection electrode CNE1 and a second connection electrode CNE2.

The first connection electrode CNE1 may be disposed on the thirdinsulating layer 30, and connected to the drain D1 through a firstcontact hole CH1 defined in the first, second, and third insulatinglayers 10, 20 and 30. A fourth insulating layer 40 may be disposed onthe first connection electrode CNE1. A fifth insulating layer 50 may bedisposed on the fourth insulating layer 40.

The second connection electrode CNE2 may be disposed on the fifthinsulating layer 50. The second connection electrode CNE2 may beconnected to the first connection electrode CNE1 through a secondcontact hole CH2 defined in the fifth insulating layer 50. A sixthinsulating layer 60 may be disposed on the second connection electrodeCNE2. The layers from the first buffer layer BFL1 to the sixthinsulating layer 60 may be defined as a circuit layer DP-CL. The circuitlayer DP-CL may include at least one metal pattern MTL (e.g., in FIG.15) such as a lower shield pattern BML, the semiconductor patterns S1,A1 and D1, the gate G1 or the connection electrodes CNE. Such at leastone metal pattern may not be included in a non-pixel unit AR2. Thenon-pixel unit AR2 may not include a semiconductor pattern or aconductive pattern, but include a plurality of insulating layers. Thenon-pixel unit AR2 may correspond to a transmissive region having agreater light transmittance than the pixel units AR1 and AR1′. In theelectronic apparatus according to an embodiment, a portion correspondingto the non-pixel unit AR2 may be referred to as a non-pixel region, anda portion corresponding to the pixel units AR1 and AR1′ may be referredto as pixel regions.

Unlike illustrated in FIG. 13, in an embodiment, circuit wiring such asthe transistor TR disposed on the second pixel unit AR1′ may not bedisposed on the second pixel unit AR1′, but disposed in a peripheralregion NAA (e.g., in FIG. 7) of a display panel. For example, in anembodiment, unlike the first pixel unit AR1, the number of circuit linessuch as the transistor TR disposed on the second pixel unit AR1′decreases, and accordingly, the wiring density in the second pixel unitAR1′ may be lower than the wiring density in the first pixel unit AR1.Meanwhile, the circuit layer DP-CL in the second pixel unit AR1 mayinclude transparent conductive layers, and the circuit lines disposed onthe light-emitting element ED and the peripheral region NAA (e.g., inFIG. 7) may be electrically connected.

A first electrode AE may be disposed on the sixth insulating layer 60.The first electrode AE may be an anode electrode. The first electrode AEmay be connected to the second connection electrode CNE2 through a thirdcontact hole CH3 defined in the sixth insulating layer 60. A pixeldefining layer PDL may be disposed on the first electrode AE and thesixth insulating layer 60. In the pixel defining layer PDL, an openingPX_OP for exposing a predetermined portion of the first electrode AE maybe defined.

The pixel defining layer PDL may be formed of a polymer resin. Forexample, the pixel defining layer PDL may be formed with apolyacrylate-based resin or a polyimide-based resin. Furthermore, thepixel defining layer PDL may be formed to further include an inorganicmaterial aside from the polymer resin. Meanwhile, the pixel defininglayer PDL may be formed with a light absorbing material or include ablack pigment or a black dye. The pixel defining layer PDL formed with ablack pigment or a black dye may define a black pixel defining layer.When the pixel defining film layer is formed, carbon black etc. may beused as the black pigment or the black dye, but embodiments are notlimited thereto.

When the pixel defining layer PDL is formed with a light absorbingmaterial, the pixel defining layer PDL may block the laser light etc.incident from under the display panel DP. For example, the pixeldefining layer PDL formed with a light absorbing material may block alaser beam of about 340 nm to about 810 nm. The pixel defining layer PDLmay not be included in the non-pixel unit AR2. The pixel defining layerPDL may overlap a polarization part PP of the polarization plate PM andmay not overlap a non-polarization part NP.

A hole transport region HTR may be disposed on the first electrode AEand on the pixel defining layer PDL. The hole transport region HTR maybe commonly disposed in a light-emitting region EA-B and anon-light-emitting region NPA. The hole transport region HTR may includea hole transport layer and a hole injection layer.

The emission layer EML may be disposed on the hole transport region HTR.The emission layer EML may be disposed on a region corresponding to anopening PX_OP. The emission layer EML may include an organic materialand/or an inorganic material. In FIGS. 12 and 13, the emission layer EMLmay be a portion that emits a blue light. Meanwhile, a secondlight-emitting region EA-G (e.g., in FIG. 9) may generate a green light,and a third light-emitting region EA-R (e.g., in FIG. 9) may generate ared light. The second light-emitting region EA-G (e.g., in FIG. 9) andthe third light-emitting region EA-R (e.g., in FIG. 9) may also have alaminated structure corresponding to the first light-emitting regionEA-B illustrated in FIGS. 12 and 13.

An electron transport region ETR may be disposed on the emission layerEML and the hole transport region HTR. The electron transport region ETRmay be commonly disposed in the light-emitting region EA-B and thenon-light-emitting region NPA. The electron transport region ETR mayinclude an electron transport layer and an electron injection layer.

The second electrode CE may be disposed on the electron transport regionETR. The second electrode CE may be a cathode electrode. The secondelectrode CE may be provided as a common layer.

Meanwhile, in an embodiment, the hole transport region HTR, the electrontransport region ETR, and the second electrode CE are illustratedextending up to the non-light-emitting region NPA, but embodiments arenot limited thereto. For example, the hole transport region HTR, theelectron transport region ETR, and the second electrode CE may also bepatterned and provided so as to correspond to the light-emitting region.

The layer on which a light-emitting element ED is disposed may bedefined as a light-emitting element layer DP-ED. An upper insulatinglayer TFL may be disposed on the light-emitting element ED.

The first electrode AE may not be included in the non-pixel unit AR2.The non-pixel unit AR2 may overlap the upper insulating layer TFL. Inaddition, when the second electrode CE is a transparent electrode, thenon-pixel unit AR2 may include at least a portion of the secondelectrode CE.

The first electrode AE may be a reflective electrode with lowtransmittance or a semi-transmissive electrode. In the manufacturingprocess for an electronic apparatus, the first electrode AE may protectthe emission layer EML and the like from laser light or moistureinfiltrating or permeating from under the base layer BL. For example,the first electrode AE may block laser light with about 340 nm to about810 nm.

The light transmittance of the polarization plate PM may be lower in aportion overlapping the pixel units AR1 and AR1′ of the display panel DPthan the light transmittance of the polarization plate PM overlappingthe non-pixel unit AR2. The pixel units AR1 and AR1′ are portionsincluding the light-emitting region EA-B and the non-light-emittingregion NPA, and the polarization plate PM overlapping the pixel unitsAR1 and AR1′ may overlap at least one among a lower shield pattern ofthe circuit layer DP-CL, the transistor TR, the first electrode AE ofthe light-emitting element layer DP-ED, or the pixel defining layer PDL.In addition, the non-polarization part NP of the polarization plate PMoverlapping the non-pixel unit AR2 may not overlap the lower shieldpattern of the circuit layer DP-CL, the transistor TR, the firstelectrode AE and the pixel defining layer PDL of the light-emittingelement layer DP-ED.

For example, in an embodiment, the lower shield pattern BML may overlapthe entirety of the second pixel unit AR1′. In an embodiment, the lowershield pattern BML may overlap the polarization part PP and may notoverlap the non-polarization part NP.

The non-polarization part NP may be a portion overlapping the bufferlayers BFL1 and BFL2, the insulating layers 10, 20, 30, 40, 50, and 60,and the upper insulating layer TFL.

FIG. 14 is a plan view image of an electronic apparatus according to anembodiment. FIG. 14 illustrates a plan view image of a portioncorresponding to a sensing region SA-DD in an electronic apparatus DD(e.g., in FIG. 1) according to an embodiment. The sensing region SA-DDmay include a second pixel unit AR1′ and a non-pixel unit AR2. Thesecond pixel unit AR1′ may include a plurality of light-emitting regionsEA-B, EA-G, and EA-R. The arrangement shape of the light-emittingregions EA-B, EA-G, and EA-R included in the second pixel unit AR1′included in the electronic apparatus according to an embodimentillustrated in FIG. 14 may be the same as the arrangement shape of thelight-emitting regions of the second pixel unit AR1′ described above inFIG. 11 and the like.

Meanwhile, in the electronic apparatus according to an embodimentillustrated in FIG. 14, the shape of the non-pixel unit AR2 may be acircular shape or a polygonal shape when viewed in a plane. The portionreferred to as the non-pixel unit AR2 and the non-polarization part ofthe polarization plate may correspond to each other. For example, theshape of the non-polarization part NP (e.g., in FIG. 13) in anembodiment may be a circular or polygonal shape corresponding to theportion referred to as the non-pixel unit AR2.

The light transmittance at the non-polarization part corresponding tothe portion referred to as the non-pixel unit AR2 may be greater thanthe light transmittance of the polarization plate at other portionsexcluding the portion referred to as the second pixel unit AR1′.

In the image illustrated in FIG. 14, the portion between the secondpixel units AR1′, the portion between the second pixel units AR1′ andthe non-pixel units AR2, and the portion between the non-pixel units AR2may be the portion corresponding to the polarization part PP (e.g., inFIG. 13) of the polarization plate. The second pixel units AR1′ may beregions including a metal pattern of a circuit layer, and the non-pixelunits AR2 may be regions that do not include a metal pattern of thecircuit layer.

FIG. 15 is a cross-sectional view illustrating a portion of anelectronic apparatus according to an embodiment. Referring to FIG. 15,the electronic apparatus according to an embodiment may include adisplay panel DP and a polarization plate PM disposed on the displaypanel DP. In an embodiment, the display panel DP includes a base layerBL, a circuit layer DP-CL disposed on the base layer BL, and alight-emitting element layer DP-ED. In the display panel DP, an upperinsulating layer TFL may be disposed on the light-emitting element layerDP-ED.

The circuit layer DP-CL may include a metal pattern MTL. The metalpattern MTL may refer to a light blocking portion provided by each ofpatterns, such as semiconductor patterns, conductive patterns,connecting lines and signal lines, which are formed in the circuit layerDP-CL, and a combination thereof.

FIGS. 12, 13, and 15 illustrate the metal pattern MTL as a single layersuch as a single semiconductor pattern, a single conductive pattern, asingle connection line, or a single signal line, but embodiments are notlimited thereto. For example, the metal pattern MTL may be formed in asingle layer or a multilayer with a shape in which those selected fromamong semiconductor patterns, conductive patterns, or signal lines arecombined to each other. For example, referring to FIGS. 12, 13, and 15,the metal pattern MTL may be a portion provided by a combination of thelower shield pattern BML, the transistor TR, the connection electrodeCNE, etc.

The metal pattern MTL may be a portion at which a first polarizationregion NSA-P and a second polarization region SA-P overlap. Thenon-polarization part NP of the second polarization region SA-P may be aportion that does not overlap the metal pattern MTL.

In an embodiment, the second display region SA-EP may include non-pixelunits AR2 that do not include the metal pattern, and pixel units AR1′including the metal pattern MTL. The non-pixel units AR2 may be referredto as non-pixel regions and the pixel units AR1′ may be referred to aspixel regions. For example, in an embodiment, the metal pattern MTL maynot be disposed in the non-pixel regions referred to as the non-pixelunits AR2.

In an embodiment, the light-emitting element layer DP-ED of the displaypanel DP may include the first electrode AE formed by a patterningprocess. The first electrode AE may not be included in the non-pixelregion of the second display region SA-EP. The pixel region may includethe patterned first electrode AE.

In an embodiment, the polarization plate PM disposed on the displaypanel DP includes a first polarization region NSA-P and a secondpolarization region SA-P. The second polarization region SA-Poverlapping the second display region SA-EP may include a polarizationpart PP and a non-polarization part NP. The average light transmittanceof the second polarization region SA-P may be greater than the averagelight transmittance of the first polarization region NSA-P.

The polarization part PP of the second polarization region SA-P mayoverlap at least one among the metal pattern MTL or the first electrodeAE. In addition, the non-polarization part NP of the second polarizationregion SA-P may not overlap both the metal pattern MTL and the firstelectrode AE.

In the electronic apparatus according to an embodiment, an electronicmodule EM (e.g., in FIG. 4) may be disposed under the display panel DPso as to overlap the second polarization region SA-P. For example, thepolarization plate PM may include the non-polarization part NP in asensing region SA-DD in which the electronic module EM (e.g., in FIG. 4)is disposed such that the polarization plate PM may have high lighttransmittance. In addition, in the electronic apparatus according to anembodiment, the polarization part PP of the polarization plate PM may beprovided so as to overlap a light blocking portion such as the metalpattern MTL or the first electrode AE included in the display panel, andremaining portions excluding the polarization part PP in the secondpolarization region SA-P may be the non-polarization part NP.Accordingly, the electronic apparatus according to an embodiment mayenhance or improve the sensitivity of the electronic module withoutdegradation in the image quality by providing a transmissive partcorresponding to the non-pixel region.

In addition, the electronic apparatus according to an embodiment mayinclude, in the non-polarization part, all remaining portions excludingthe portion overlapping the light blocking portion such as the metalpattern included in the display panel in the second polarization regionof the polarization plate overlapping the electronic module.Accordingly, the electronic apparatus according to an embodiment mayexhibit or have high light transmittance in the second polarizationregion, and exhibit or have improved display quality and superiorelectronic module sensitivity in the sensing region corresponding to thesecond polarization region of the electronic apparatus.

Hereinafter, a manufacturing method for an electronic apparatusaccording to an embodiment will be described with reference to theaccompanying drawings. FIG. 16 is a flowchart for a manufacturing methodfor an electronic apparatus according to an embodiment. FIGS. 17, 18,and 19 are views schematically illustrating the steps of themanufacturing method for an electronic apparatus of an embodiment.

Hereinafter, in the description on the manufacturing method for anelectronic apparatus according to an embodiment to be described withreference to FIGS. 16, 17, 18, and 19, the contents overlapping thedescription on the electronic apparatus according to an embodimentdescribed with reference to FIGS. 1 to 15 will not be described again.In addition, in the description on the manufacturing method for anelectronic apparatus according to an embodiment to be described withreference to FIGS. 16, 17, 18, and 19, the above-described portion theelectronic apparatus according to an embodiment may be applied the sameto the portion on the configurations of the electronic apparatus.

The manufacturing method S10 for an electronic apparatus according to anembodiment may include a step S100 of providing a display panel, a stepS300 of providing a polarization plate, and a step S500 of patterningthe polarization plate. The manufacturing method S10 for an electronicapparatus according to an embodiment may include, after the step S500 ofpatterning a polarization plate, a step S700 of disposing an electronicmodule. The electronic module may be disposed so as to overlap a secondpolarization region of the patterned polarization plate.

FIGS. 17 and 18 schematically illustrate the step S100 of providing adisplay panel and a step S300 of providing a polarization plate, andFIG. 19 schematically illustrates the step S500 of patterning thepolarization plate.

Referring to FIGS. 17 and 18, in the step S100 of providing a displaypanel, the display panel DP may include a first display region NSA-EPand a second display region SA-EP. The second display region SA-EP maybe a portion having a lower pixel density than the first display regionNSA-EP.

In the step S300 of providing a preliminary polarization plate P-PM, thepolarization plate P-PM including a first polarization region NSA-P anda second polarization region SA-P is provided on the display panel DP.The first polarization region NSA-P may be provided so as to correspondto the first display region NSA-EP, and the second polarization regionSA-P may be provided to correspond to the second display region SA-EP.

Meanwhile, the preliminary polarization plate is referred to as thereference indicator “P-PM” in the illustration of FIGS. 17 and 18, andthe reference indicator “P-PM” is used to distinguish the preliminarypolarization plate P-PM from the polarization plate PM. For example, thepreliminary polarization plate P-PM may have the state before thepolarization plate PM is patterned so as to include a non-polarizationpart NP. For example, the polarization plate PM may be formed bypatterning the preliminary polarization plate P-PM.

The display panel DP may include a base layer BL, a circuit layer DP-CLincluding a metal pattern MTL, and a light-emitting element layer DP-EDincluding a first electrode AE. The metal pattern MTL and the firstelectrode AE may correspond to a mask MSK that blocks light. FIG. 17illustrates a configuration in which the single-layer metal pattern MTLand the first electrode of the light-emitting element layer DP-ED areonly included in the mask MSK, but the mask MSK may also include theconfiguration of another light blocking portion in the display panel DP.For example, an opaque layer included in the circuit layer DP-CL may beused as the mask MSK.

For example, in the description on the electronic apparatus according toan embodiment described with reference to FIGS. 1 to 15, theconfiguration of semiconductor patterns, conductive patterns, connectionlines, signal lines etc., which are included in the circuit layer DP-CLand block laser light, and the pixel defining layer and the like, whichare included in the light-emitting element layer DP-ED and having alight blocking function, may be included in the mask MSK.

In the second display region SA-EP, the mask MSK is a portion that isincluded in the pixel unit AR1′ and is not included in the non-pixelunit AR2.

FIG. 19 is a view schematically illustrating the step S500 of patterningthe polarization plate. Referring to FIGS. 16, 17, 18, and 19, the stepS500 of patterning the polarization plate may include a step 510 ofirradiating laser light in the second display region SA-EP, and a stepS530 of providing a cleaning liquid to the second polarization regionabove the polarization plate. For example, in the step 510, the laserlight may be irradiated from under the display panel.

In an embodiment, the polarization plate PM may include, on theuppermost layer thereof, a polarizer layer PL (e.g., in FIG. 5A), andthe polarizer layer may include a polymer film and light absorbersadsorbed onto the polymer film (e.g., dispersed in the polymer film).The step S510 of irradiating the laser light in the second displayregion SA-EP may include the step of detaching the light absorbersadsorbed onto the polymer film.

The emitted laser light LS may be light selected from the wavelengthrange of about 340 nm to about 810 nm. The laser light LS may becontinuous wave laser or pulse laser. For example, the laser light maydischarge or emit light in the green wavelength range.

A light source LAP that provides the laser light LS may be disposedunder the display panel DP and provide the laser light LS while movingalong the first direction axis DR1. The laser light LS may be blocked atthe mask MSK which is an opaque pattern layer disposed in the circuitlayer DP-CL, and pass through the display panel at the portion in whichthe mask MSK is not disposed, and be provided to the polarization platePM. The laser light LS may be provided in the direction to thepolarization plate PM under the base layer BL of the display panel DP.

Meanwhile, a separate patterning mask may also be provided under thedisplay panel aside from the mask MSK disposed in the circuit layerDP-CL. The laser light LS may be provided to the polarization plate PMby passing through the patterning mask disposed under the display panelDP.

Meanwhile, FIG. 19 illustrates that the laser light LS is provided usinga single light source LAP, but embodiments are not limited thereto. Forexample, a plurality of light sources LAP may be disposed under thedisplay panel DP and provide laser light LS to portions that are notblocked by the mask MSK.

The laser light LS may not pass through blocked regions MSA blocked bythe mask MSK, and the laser light LS is emitted through projectionregions between the blocked regions MSA. A preliminary non-polarizationpart P-NP before emitting laser light LS may be a portion having thesame configuration as the polarization part PP. The preliminarynon-polarization part P-NP may be formed as a non-polarization part NPby providing the laser light LS and a cleaning liquid CW.

In the step 530 of providing a cleaning liquid to the secondpolarization region above the polarization plate, the cleaning liquidmay be provided to a polarizer layer (e.g., in FIG. 5A) which is theuppermost layer. The step S530 of providing a cleaning liquid to thesecond polarization region above the polarization plate may include thestep of extracting light absorbers detached from the polymer filmthrough the step S510 of irradiating the laser light.

For example, in the step S530 of providing a cleaning liquid, thecleaning liquid CW is provided on to the polarizer layer by dissolvingand extracting a dichromic dye or iodine from the polarizer layer. Thecleaning liquid CW may be a neutral solution. The cleaning liquid CW maybe a solution having a pH value from about pH 6 to about pH 8. Forexample, the cleaning liquid CW may be water, or an organic solvent. Thecleaning liquid CW may be deionized water. In addition, the cleaningliquid may include alcohol, acetone, ethyl acetate, or the like.

The cleaning liquid CW may be provided in a liquid phase through a spraymethod, may be provided on the polarization plate in a steam formthrough a steam jet method, or may be provided to the polarization plateusing a dipping method.

The step S530 of providing a cleaning liquid may be performed at theroom temperature. In addition, unlike this, the step S530 of providing acleaning liquid may be performed at a high temperature. In this case,the step 530 may be performed at a temperature of the vaporizationtemperature or lower.

The step S510 of irradiating the laser light in the second displayregion SA-EP and the step S530 of providing a cleaning liquid to thesecond polarization region above the polarization plate may be performedat the same step. Performing in the same step is not limited toperforming simultaneously in time.

For example, the step S510 of irradiating the laser light in the seconddisplay region SA-EP and the step S530 of providing a cleaning liquid tothe second polarization region above the polarization plate may beperformed in single equipment without moving the display panel or thepolarization plate to be processed. In addition, in the entire processof the step S510 of irradiating the laser light in the second displayregion SA-EP, the step 530 of providing a cleaning liquid may beperformed. Meanwhile, the step of providing a cleaning liquidsimultaneously with emitting laser light LS may not be performed, andthe cleaning liquid may also be provided before and after emitting thelaser light LS.

The step S500 of patterning a polarization plate may include patterningthe second polarization region SA-P into a polarization part PP and anon-polarization part NP. The non-polarization part NP may be a portionhaving higher light transmittance than the polarization part PP. Thenon-polarization part NP may be a portion formed by detaching orremoving light absorbers from the polarizer layer.

The step S500 of patterning a polarization plate may include the step ofpatterning the second polarization region SA-P so as to include apolarization part PP overlapping the mask MSK which includes at leastone among the metal pattern or the first electrode and anon-polarization part NP which does not overlap the metal pattern andthe first electrode.

A manufacturing method for an electronic apparatus according to anembodiment may provide an electronic apparatus exhibiting or havingsuperior display quality even in a portion in which an electronic moduleis disposed by including a step of patterning a polarization plate withlight blocking portions included in a display panel serving as a mask,because a non-polarization part may be patterned without damage to theoptical quality of the polarization plate of a portion corresponding toa pixel region. In addition, a manufacturing method for an electronicapparatus according to an embodiment may provide an electronic apparatushaving improved transmittance in a portion overlapping the electronicmodule by performing a step of emitting laser light under the displaypanel and a step of providing a cleaning liquid above the polarizationplate to pattern the polarization plate using a metal pattern of acircuit layer.

An embodiment may provide an electronic apparatus which has improvedlight transmittance in a portion overlapping an electronic module byincluding a patterned non-polarization part in a polarization regionoverlapping the electronic module.

A manufacturing method for an electronic apparatus according to anembodiment includes emitting laser light from under a display panel topattern a polarization plate and thus may be used to manufacture anelectronic apparatus having improved light transmittance in a regionoverlapping an electronic module.

Although certain embodiments and implementations have been describedherein, other embodiments and modifications will be apparent from thisdescription. Accordingly, the inventive concepts are not limited to suchembodiments, but rather to the broader scope of the appended claims andvarious obvious modifications and equivalent arrangements as would beapparent to a person of ordinary skill in the art.

What is claimed is:
 1. An electronic apparatus comprising: an electronic module; a display panel disposed on the electronic module and comprising a first display region and a second display region adjacent to the first display region, the second display region overlapping the electronic module; and a polarization plate disposed on the display panel and comprising a first polarization region overlapping the first display region and a second polarization region comprising a polarization part and a non-polarization part having higher light transmittance than the polarization part, the non-polarization part overlapping the second display region.
 2. The electronic apparatus of claim 1, wherein: the polarization plate comprises a polarizer layer as an uppermost layer, and the polarizer layer comprises a polymer film and a light absorber dispersed in the polymer film.
 3. The electronic apparatus of claim 2, wherein a number of the light absorber per unit area in the non-polarization part is smaller than a number of the light absorber per unit area in the first polarization region and the polarization part.
 4. The electronic apparatus of claim 2, wherein the non-polarization part is formed by removing the light absorber from the polymer film.
 5. The electronic apparatus of claim 1, wherein the display panel comprises: a base layer; a circuit layer disposed on the base layer and comprising at least one metal pattern; and a light-emitting element layer disposed on the circuit layer and comprising a first electrode and a second electrode facing each other, and an emission layer disposed between the first electrode and the second electrode, wherein the second display region comprises a non-pixel region that does not comprise the at least one metal pattern and the first electrode, and a pixel region that comprises the at least one metal pattern and the first electrode.
 6. The electronic apparatus of claim 5, wherein: the non-pixel region overlaps the non-polarization part, and the pixel region overlaps the polarization part.
 7. The electronic apparatus of claim 5, wherein: the polarization part overlaps at least one among the at least one metal pattern and the first electrode; and the non-polarization part does not overlap both the at least one metal pattern and the first electrode.
 8. The electronic apparatus of claim 5, wherein the at least one metal pattern comprises at least one among a lower shield pattern, a transistor, and a connection electrode.
 9. The electronic apparatus of claim 8, wherein the non-polarization part does not overlap the at least one metal pattern.
 10. The electronic apparatus of claim 1, wherein: each of the first display region and the second display region comprises a plurality of pixel units; and a number of the pixel units per unit area in the second display region is smaller than a number of the pixel units per unit area in the first display region.
 11. The electronic apparatus of claim 10, wherein each of the plurality of pixel units comprises a first color light-emitting region, a second color light-emitting region, and a third color light-emitting region.
 12. The electronic apparatus of claim 1, wherein: the first display region comprises a first pixel unit comprising a plurality of light-emitting regions arranged spaced apart from each other when viewed in a plane; and the second display region comprises a second pixel unit comprising a plurality of light-emitting regions arranged different from an arrangement of the plurality of light-emitting regions in the first pixel unit.
 13. The electronic apparatus of claim 1, wherein the second display region has a lower pixel density or a lower wiring density than the first display region.
 14. The electronic apparatus of claim 1, further comprising a support member disposed under the display panel and comprising a through-hole overlapping the electronic module.
 15. A manufacturing method of an electronic apparatus comprising the steps of: providing a display panel comprising a first display region and a second display region adjacent to the first display region, the second display region having different transmittance from the first display region; providing, on the display panel, a polarization plate comprising a first polarization region overlapping the first display region and a second polarization region overlapping the second display region; and patterning the provided polarization plate, wherein the step of patterning of the polarization plate comprises the steps of: irradiating laser light in the second display region from under the display panel; and providing a cleaning liquid to the second polarization region from above the polarization plate.
 16. The manufacturing method of claim 15, wherein: the polarization plate comprises a polarizer layer on an uppermost layer thereof; the polarizer layer comprises a polymer film and a light absorber dispersed in the polymer film; the step of irradiating the laser light in the second display region comprises the step of detaching the light absorber in the polymer film; and the step of providing of the cleaning liquid comprises the step of extracting the detached light absorber.
 17. The manufacturing method of claim 16, wherein: the step of patterning of the polarization plate comprises the step of patterning the second polarization region into a polarization part and a non-polarization part having higher light transmittance than the polarization part; and the non-polarization part is a portion formed by detaching the light absorber from the polymer film.
 18. The manufacturing method of claim 16, wherein the display panel comprises: a base layer; a circuit layer disposed on the base layer and comprising a metal pattern; and a light-emitting element layer disposed on the circuit layer and comprising a first electrode, a second electrode, and an emission layer disposed between the first electrode and the second electrode, and in the step of irradiating the laser light in the second display region, the laser light is irradiated in a direction to the polarization plate from under the base layer by using at least one among the metal pattern or the first electrode serving as a mask.
 19. The manufacturing method of claim 18, wherein the step of patterning of the polarization plate comprises the step of patterning the second polarization region so as to comprise a polarization part that overlaps at least one among the metal pattern or the first electrode and a non-polarization part that does not overlap the metal pattern and the first electrode.
 20. The manufacturing method of claim 15, wherein the laser light is selected from a wavelength range of about 340 nm to about 810 nm.
 21. The manufacturing method of claim 15, wherein the step of irradiating the laser light in the second display region and the step of providing of the cleaning liquid are performed in a same step.
 22. The manufacturing method of claim 15, wherein the step of providing of the cleaning liquid comprises the step of providing the cleaning liquid by using a spray method, a steam jet method, or a dipping method.
 23. The manufacturing method of claim 15, wherein the cleaning liquid is a neutral solution.
 24. The manufacturing method of claim 23, wherein the cleaning liquid is deionized water.
 25. The manufacturing method of claim 15, further comprising the step of disposing an electronic module under the display panel after the step of patterning of the polarization plate.
 26. The manufacturing method of claim 25, wherein the step of disposing of the electronic module comprises the step of disposing the electronic module so as to overlap the second display region. 